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Chiplets answer the difficulty designing monolithic ICs for advanced nodes but they present their own challenges for areas such as floorplanning and optimizing PPA. Consequently, packaging is a delicate task. An extended technical article – originally...

Rigid-flex technology is in  increasing use for PCB design. It offers many advantages on projects that must be compact, lightweight and flexible – or any combination of them. The Internet of Things is one leading driver for the its use, but its appeal...

Design technology co-optimization (DTCO) has become ever more important toward the prevention and prompt capture of systematic defects in increasingly complex design. It has its foundations in the early-stage exchange of valid data during steps such...

Early package assembly verification allows engineers to catch issues quickly, when they are easier to fix. But it requires a through understanding of the multiple chiplets that make up today’s 2.5D and 3D designs. The process also requires a tool infrastructure...

Arm has launched what the company claims is its highest-performance and most-efficient AI accelerator. According to the IP vendor, the Ethos-U85 NPU delivers a four-fold speed boost compared to its predecessor. The new core also offers a 20% improvement...